Tenting工艺是减法工艺(Subtractive Process)，其工艺是在导体层上先贴敷上感光胶膜，通过图形转移技术，形成感光膜图形；再通过蚀刻工艺，将图形间的间隙咬蚀掉。Tenting工艺在已经形成的导体层上进行蚀刻加工，导体层越厚，对线路咬蚀量越大，精细线路的形成能力较差。

Tenting工艺是线路板行业最传统的图形形成工艺，工艺难度低，应用最为广泛，其生产工艺过程如下：

Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film resist over conductor layer and metallized holes/vias, and forming the circuits pattern on photosensitive film after exposing and developing; and then forming the circuits pattern on the conductor by etching. As circuits pattern is etching on the conductor Layer, the thicker the conductor, the more etching needed. The capability of fine line/space forming of Tenting is lower than SAP & msap.              

Tenting process is the most widely used in PCB industry, the technical difficulty is low, the pattern forming process is as follows: